FBGA (Fine Pitch BGA)
3D Technology - Stacked CSP
Chip on Film (COF)
Quad Flat No Lead Package (QFN)
Low-Profile Quad Flat Pack (LQFP)
Multi-Chip & Stacked Leadframe
Small Outline Package (SOP)
TSOP-I/TSOP-II/TSOP-II (LOC)
FC DFN/QFN (Flip chip DFN/QFN)
FC CSP (Flip chip CSP)
WLCSP (Wafer Level Chip Scale Package)
FPS (Finger Print Sensor)
ChipMOS' Chip on Film (COF) package provides both mechanical and electrical support to the display driver semiconductors between the display panel and the driving module for the application in flat panel displays. Furthermore, the driving module can be manufactured by using COF technology with finer inner lead pitch and more lead counts. Turn-key services for COF packages, from gold bumping to final test, are available in current ChipMOS assembly lines.
Applications
Main applications are for driving display panel in LCD/OLED TV/monitor, NB, cellular phone, fingerpint sensor… etc.
Features
- Fine pitch COF
- COF with module
Reliability
Storage
| HT storage | 125°C | 1000 hr. |
| LT storage | -65°C | 1000 hr. |
| HT/HH storage | 85°C/85% RH | 1000 hr. |
| PCT | 121°C/100% RH/2ATM | 96 hr. |
Cycling
| TCT | -65/125°C | 100 cycles |
| TST | -45/125°C | 100 cycles |
| THC | -10~65°C/90~96% RH | 10 cycles |
Bias
| HT operation | 125°C | 1000 hr. |
| HT/HH Bias | 85°C/85% RH | 1000 hr. |
Mechanical
| MPT | MIL Solution-D | 10-stokes |
| Solderability | Wetting balance |
Process Highlights
COF package
- Tape width: 35mmW/SW, 48mmW/SW, 70mmW/SW
- Pattern layer: 1 metal layer, 2 metal layer
- Thermal dissipation enhancement: Heat spreader, Tharmal paste
- Max. tape length: 100 mm
- Min pitch: 16 μm
- Min. chip thickness: 8 mil (200 μm)
- Marking: Laser
- Packing: Φ530 standard plastic reel
