Reliability tests, based on international standards and customer specifications, are fully integrated into ChipMOS’s product qualification system, covering new package, engineering/process change qualification, and mass production monitoring. All tests are conducted in accordance with JEDEC and MIL-STD requirements. Furthermore, the ChipMOS Lab is TAF-certified (No. 0758) in the field of package reliability testing, providing real-time failure analysis to identify root causes for any anomalies occurring during manufacturing or reliability testing.