FBGA (Fine Pitch BGA)
3D Technology - Stacked CSP
Chip on Film (COF)
Quad Flat No Lead Package (QFN)
Low-Profile Quad Flat Pack (LQFP)
Multi-Chip & Stacked Leadframe
Small Outline Package (SOP)
TSOP-I/TSOP-II/TSOP-II (LOC)
FC DFN/QFN (Flip chip DFN/QFN)
FC CSP (Flip chip CSP)
WLCSP (Wafer Level Chip Scale Package)
FPS (Finger Print Sensor)
SOP package is a lead frame based package with gull-wing type leads, which are drawn out from the two sides of the package body. SOP packages give user strong packaging choice for low pin count devices in all types of application.
Applications
SOP package is suitable for memory module, portable consumer products, cell phones and office appliances, etc.
Features
- 208 mil body width
- 8 leads available
- Customer lead frame design available
- Broad selection of die pad size
Reliability
| Moisture sensitivity | JEDEC Level 3 | - |
| High Temp. Storage Test | 150°C | 1000 hr. |
| Temperature Cycling Test | -65°C/150°C | 500 cycles |
| Thermal Shock Test | -65°C/150°C | 500 cycles |
| Pressure Cooker Test | 121°C/100% RH/2 atm | 240 hr. |
| Temp. & Humidity Test | 85°C/85% RH | 1000 hr. |
Process Highlights
| Wafer Backside grinding | Available |
| Die Thickness | 10~16 mil |
| Solder Plating | 85Sn/15Pb |
| Marking | Laser |
| Coplanarity | < 4 mil |
| Lead Inspection | Laser/Optical |
| Packing/Shipping | Bar code, dry packing |