Advanced package
- WL CSP
- FC DFN
- SiP
Laminate
- TFBGA
- Fine Pitch BGA (FBGA)
- Very Fine Pitch BGA (VFBGA)
- MCM-PBGA
- Land Grid Array (LGA)
Display Driver IC (DDIC)
- Chip on Film (COF)
- Chip On Glass (COG)
LeadFrame
- QFN
- QFP
- LQFP
- TQFP
- Multi-Chip & Stacked Leadframe
- SOP
- TSOP (I) and (II)
FBGA (Fine Pitch BGA)
3D Technology - Stacked CSP
Chip On Film (COF)
Quad Flat No Lead Package (QFN)
Quad Flat Package (QFP)
Low-Profile Quad Flat Pack (LQFP)
Thin Quad Flat Package (TQFP)
Multi-Chip & Stacked Leadframe
Small Outline Package (SOP)
TSOP-I/TSOP-II/TSOP-II (LOC)
FC DFN (Flip chip DFN)
WL CSP (Wafer Level Chip Scale Package)
FPS (Finger Print Sensor)