FBGA (Fine Pitch BGA)
3D Technology - Stacked CSP
Chip on Film (COF)
Quad Flat No Lead Package (QFN)
Low-Profile Quad Flat Pack (LQFP)
Multi-Chip & Stacked Leadframe
Small Outline Package (SOP)
TSOP-I/TSOP-II/TSOP-II (LOC)
FC DFN/QFN (Flip chip DFN/QFN)
FC CSP (Flip chip CSP)
WLCSP (Wafer Level Chip Scale Package)
FPS (Finger Print Sensor)
The LQFP package is a low-profile and light-weight package designed for application-specific integrated circuits, digital signal processors, microprocessors / controllers, graphic processors, gate arrays, synchronous static random access memories (SSRAM), computer chipsets and mixed-signal devices.
Applications
Main applications are for wireless communication products, notebook computers, digital cameras, etc.
Features
ChipMOS' LQFP package provides:
- 7 x 7 mm body size
- Copper lead frames
- 1.4 mm body thickness
- 0.127 mm lead frame thickness
- 2.0 mm foot print
- 48 lead counts
- Customer lead frame design available
- Broad selection of die pad sizes
Reliability
| Moisture sensitivity | JEDEC Level 3 | - |
| High Temp. Storage Test | 150°C | 1000 hr. |
| Temperature Cycling | -65°C/150°C | 1000 cycles |
| Thermal Shock Test | -65°C/150°C | 200 cycles |
| Pressure Cooker Test | 121°C/100% RH/2 atm | 240 hr. |
| Temp. & Humidity Test | 85°C/85% RH | 1000 hr. |
Process Highlights
| Wafer Backside grinding | Available |
| Die Thickness | 12.5 ± 0.5 mil |
| Solder Plating | 85Sn/15Pb |
| Marking | Laser |
| Coplanarity | < 4 mil |
| Lead Inspection | Laser/Optical |
| Packing/Shipping | Bar code, dry packing |
Shipping
JEDEC standard tray