Recycle and Reuse
Reduction of Material Source
ChipMOS provides complete semiconductor back-end process services. The main raw materials for packaging, testing and materials include Solder Ball, Lead Frame, Substrate, Molding Compound, etc. We continue refining the production process, strive to improve the source, reduce waste, and understand the use of various materials by analyzing the annual material consumption rate. During 2017-2018, we continued optimizing the use of substrates and lead frames between production machines to reduce the consumption of invalid materials. Through the consolidation and utilization of materials, the switching consumption of molding compound was reduced, and the major raw material consumption was greatly improved. In the recent three years, in the consumption rate of the major raw materials, the part of compounds has been continuously improved and decreased year by year; and the remaining raw materials have been optimized the utilization efficiency, and reached the target loss value has been achieved. The target values of raw material consumption for 2021 are: solder ball (3%); lead frame (1.9%), substrate (0.6%), compound (4%); the target values of consumption are adjusted based on the planned product mixes to be produced for the year.
Recycling of Packaging Materials
ChipMOS provides professional and vertically integrated packaging and testing services. During the transportation of customers’supplied chips and IC products, we need to use wafer boxes and trays as the carrying tools, in combination with cartons and sponge buffer materials to achieve the effects of product protection. In order to reduce waste generation and reduce environmental load, we recycle and reuse reusable packaging materials.
Statistics of Main Packaging Materials for Recycling from 2017 to 2021 listed below:
Proper Waste Disposal
In order to ensure that the wastes generated under the operation of ChipMOS comply with the environmental, safety and health treatment procedures, in addition to its own operation activities, ChipMOS also inspects the waste related impacts caused by upstream / downstream activities of the value chain, and comprehensively grasps the impact on the environment. Based on the ISO 14001 Environmental Management System, ChipMOS conducts environmental impact assessment and response management every year from the perspective of product life cycle, including raw material supply, in-fab production and manufacturing, and waste disposal.
The wastes generated in the upstream and downstream stages of ChipMOS have relatively low environmental impacts. For the upstream (raw material stage), ChipMOS adopts green materials to make the products free of environmentally harmful substances; for the downstream (waste treatment) , ChipMOS entrusts qualified manufacturers to handle it according to law and conducts regular audit and supervision. The hazardous waste generated by the production and manufacturing in the fab has relatively high environmental impacts. We further develop risk / opportunity and action measures or target management schemes to minimize the impacts on the environment.
ChipMOS has promoted the waste reduction plan year by year, and together with the functions like process, fab affairs, etc., extended the concepts of "Life Cycle" and "Source Management", and sought for reduction and recycling plans from the process and machine production process, and driven the circular economy in the fab, and made full use of resources through reduction, reuse, recycling and other ways, while taking into account economic development and environmental protection. In addition, the fab promotes "ISO 14051 Material Flow Cost Accounting", in order to master various information as the basis for management improvement, so that waste can become a resource in the circular economy, and then improve the value of resource reuse.
▼Waste Disposal in 2021