FBGA (Fine Pitch BGA)
3D Technology - Stacked CSP
Chip On Film (COF)
Quad Flat No Lead Package (QFN)
Quad Flat Package (QFP)
Low-Profile Quad Flat Pack (LQFP)
Thin Quad Flat Package (TQFP)
Multi-Chip & Stacked Leadframe
Small Outline Package (SOP)
TSOP-I/TSOP-II/TSOP-II (LOC)
FC DFN (Flip chip DFN)
WL CSP (Wafer Level Chip Scale Package)
FPS (Finger Print Sensor)
Unlike SOP packages, QFP package is a flat structure with 4-sided peripheral leads which provides medium high pin counts ( ＜ 256 leads). QFP package is often used for SRAM, graphic processors, PC Chipsets, digital signal processors, multi-media and other related devices. ChipMOS' QFP packages provides:
ChipMOS' QFN package provides:
| Package Size | Lead counts |
| 10 x 10 x 2 mm | 44 |
| 14 x 20 x 2.8 mm | 100/128 |
| 28 x 28 x 3.2 mm | 160/208 |
Applications
Main applications are for consumer products, notebook computers, PCs, automotive technology, etc.
Features
- Copper lead frames
- Customer lead frame design available
- Broad selection of die pad sizes
Reliability
| Moisture sensitivity | JEDEC Level 3 | - |
| High Temp. Storage Test | 150°C | 1000 hr. |
| Temperature Cycling | -65°C/150°C | 1000 cycles |
| Thermal Shock Test | -65°C/150°C | 200 cycles |
| Pressure Cooker Test | 121°C/100% RH/2 atm | 240 hr. |
| Temp. & Humidity Test | 85°C/85% RH | 1000 hr. |
Process Highlights
| Wafer Backside grinding | Available |
| Die Thickness | 16 ± 0.5 mil |
| Solder Plating | 85Sn/15Pb |
| Marking | Laser/IR Ink |
| Coplanarity | < 4 mil |
| Lead Inspection | Laser/Optical |
| Packing/Shipping | Bar code, dry packing |
Shipping
JEDEC standard tray