FBGA (Fine Pitch BGA)
3D Technology - Stacked CSP
Chip On Film (COF)
Quad Flat No Lead Package (QFN)
Quad Flat Package (QFP)
Low-Profile Quad Flat Pack (LQFP)
Thin Quad Flat Package (TQFP)
Multi-Chip & Stacked Leadframe
Small Outline Package (SOP)
TSOP-I/TSOP-II/TSOP-II (LOC)
FC DFN (Flip chip DFN)
WL CSP (Wafer Level Chip Scale Package)
FPS (Finger Print Sensor)
The TQFP is designed for low-profile and light-weight portable and consumer electronics. With 1.2 mm maximum of package total height, TQFP can meet the increasing board density and limited volume requirement for state-of-the-art products.
Applications
The main application is for notebook computers, personal computers, disk drivers, office equipment, audio and video products and wireless communication products.
Features
ChipMOS' TQFP package provides:
- 10 x 10 mm and 14 x 14 mm body size
- Copper lead frames
- 1.0 mm body thickness
- 0.127 mm lead frame thickness
- 2.0 mm foot print
- 44/64/80/100/128 leads
- Customer lead frame design available
- Broad selection of die pad sizes
Reliability
| Moisture sensitivity | JEDEC Level 3 | - |
| High Temp. Storage Test | 150°C | 1000 hr. |
| Temperature Cycling Test | -65°C/150°C | 1000 cycles |
| Thermal Shock Test | -65°C/150°C | 200 cycles |
| Pressure Cooker Test | 121°C/100% RH/2 atm | 240 hr. |
| Temp. & Humidity Test | 85°C/85% RH | 1000 hr. |
Process Highlights
| Wafer Backside grinding | Available |
| Die Thickness | 12.5 ± 0.5 mil |
| Solder Plating | 85Sn/15Pb |
| Marking | Laser/IR Ink |
| Coplanarity | < 4 mil |
| Lead Inspection | Laser/Optical |
| Packing/Shipping | Bar code, dry packing |
Shipping
JEDEC standard tray