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FBGA (Fine Pitch BGA) 3D Technology - Stacked CSP Chip On Film (COF) Quad Flat No Lead Package (QFN) Quad Flat Package (QFP) Low-Profile Quad Flat Pack (LQFP) Thin Quad Flat Package (TQFP) Multi-Chip & Stacked Leadframe Small Outline Package (SOP) TSOP-I/TSOP-II/TSOP-II (LOC) FC DFN (Flip chip DFN) WL CSP (Wafer Level Chip Scale Package) FPS (Finger Print Sensor)

The FPS package was designed as a cost-effective LGA solution specifically for Finger print sensor devices. The structure provides the narrowest mold gap from die surface to package surface and high electrical performance for the sensor induction capability through the use of high DK compound and compression mold technology. Generally, FPS is defined to have the thickness of 0.4 - 0.8 mm and 0.8 – 1.2 mm pin pitch. ChipMOS offers several packages, including:

  Package Size Connections
FPS 7.95 x 15.95 mm 22
9.4 x 9.4 mm 24/28
10.4 x 10.4 mm 12/22
11.1 x 11.1 mm 24/28
12 x 12 mm 20/22/24/26/28/40
14 x 4.1 mm 26
14.4 x 6 mm 22/26
16 x 6.5 mm 34
Structure of FPS

Applications

The FPS package majorly apply on mobile phone / note book / credit card as personal identification by finger print detection.

Features

ChipMOS' FPS packaging provides:

  • Die-up structure
  • FOD structure
  • Thin core substrate material (BT)
  • High DK value compound (7)
  • Narrow mold gap solution (50 um)
  • Package thickness range from 0.4 to 1.0 mm
  • Customer substrate design available
Reliability
Moisture sensitivity JEDEC Level 3 -
High Temp. Storage Test 150°C 1000 hr.
Temperature Cycling -55°C/125°C 1000 cycles
Pressure Cooker Test 121°C/100% RH/2 atm 168 hr.
Temp. & Humidity Test 85°C/85% RH 1000 hr.
Process Highlight
Wafer Backside grinding Available
Die Thickness 50 ~ 450 um
Mold gap 50 +/- 10 mm
Forming Laser routing / Package saw
Unit warpage < 50 um
Strip warpage +/- 4 mm
Packing/Shipping Bar code, dry packing, strip type

Shipping
JEDEC standard tray

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