Advanced package
- WLCSP
- FC DFN
- SiP
- FC CSP
Laminate
- TFBGA
- Fine Pitch BGA (FBGA)
- Very Fine Pitch BGA (VFBGA)
- Land Grid Array (LGA)
Display Driver IC (DDIC)
- Chip on Film (COF)
- Chip on Glass (COG)
- Chip on Plastic (COP)
LeadFrame
- QFN
- LQFP
- Multi-Chip & Stacked Leadframe
- SOP
- TSOP (I) and (II)
FBGA (Fine Pitch BGA)
3D Technology - Stacked CSP
Chip on Film (COF)
Quad Flat No Lead Package (QFN)
Low-Profile Quad Flat Pack (LQFP)
Multi-Chip & Stacked Leadframe
Small Outline Package (SOP)
TSOP-I/TSOP-II/TSOP-II (LOC)
FC DFN/QFN (Flip chip DFN/QFN)
FC CSP (Flip chip CSP)
WLCSP (Wafer Level Chip Scale Package)
FPS (Finger Print Sensor)