Analysis Process

In order to make sustainability issues cover the overall operations of the Company, ChipMOS convened all members responsible for ESG development such as environment, society, governance and products to review the diversified communication results and feedback of stakeholders. After sorting and classifying the trends of industrial development and international ESG issues, 21 sustainability issues of general and industrial characteristic were finally determined. Based on the suggestions of various groups, the main stakeholders concerned were divided into six classes: stakeholders, customers, employees, suppliers, government agencies and community groups. In the third phase, we collected 376 stakeholder concern questionnaires and 86 two-way impact questionnaires. Using the matrix of issue impact and stakeholder importance, we identified 8 material topics for 2022. The fourth step examined the influence boundary of the 8 material topics, including the organization itself, upstream industries and downstream industries. Finally, target management was carried out for various material topics that could respond to the requirements of the United Nations development goals.

Analysis Results

After comprehensive consideration of the impact of the issues and the concerns of stakeholders, we have identified and determined 8 material topics for ChipMOS in 2022. Compared to the results of analysis from 2021, our stakeholders showed greater concern in "Energy and resources efficiency". These 8 material topics corresponded to two environmental aspects, two social aspects and, three governance aspect and one product aspect of the GRI Standards.

Boundary of Material Topics

ChipMOS provided (display Driver IC, memory and mixed-signal) and the upstream and downstream value chain. The impact categories are divided into direct cause, indirect cause and business partnership.

Impact Management of Material Topics

ChipMOS assess the impact of Material Topics on the Company and take mitigation measures and target management.