Product/Failure Analysis Capability

Instrument Application
X-Ray Microscope Internal structure observation
Scanning Acoustic Tomograph Package delamination inspection
Scanning Electron Microscope Micro-structure analysis
Energy Dispersive Spectrometer Chemical Element identification
Optical Microscope Visual inspection (up to 1000X)
Decapsulator Package compound removal
Cutter,Grinder and Polisher Cross-section preparation
Open/Short Tester Parameter electrical testing
Curve Tracer I/V characteristic analyzing
Probe Station Device electrical identification
Ion milling system Ion polish treatment
Fourier Transform InfraRed  Organic element identification