ESG News

ChipMOS and Southern Taiwan University of Science and Technology (STUST) held the ceremony for signing the industrial-academic collaboration agreement and the donation of equipment at the Semiconductor Center, STUSC on June 30, and the representatives from industries, academies and governmental agencies, including Yang, Yu-Huei, Director-General, Department of Technological and Vocational Education, MOE; Cheng, Hsiu-Rong, Deputy General-Director of Southern Taiwan Science Park Bureau, Lu, Deng-Mao, President of Southern Taiwan University of Science and Technology; Cheng, Shi-Jie, Chairman of ChipMOS; and Wang, Xin-Ji, Director-General, Labor Affairs Bureau of Tainan City Government also participated in the press conference as witnesses.

Cheng, Shi-Jie, Chairman of ChipMOS said that the signing of the industrial-academic collaboration agreement and the donation of the “equipment machine for the key packaging processes” are seeking to deepen the industrial-academic collaboration of both parties for the technologies. With the equipment and the practical teachings from the ChipMOS instructor, it is sought to give the students of STUST the opportunity to learn the practical operation of the equipment for the key packaging processes when they are in the school, and grasp the practical experience as updated as the industry, to foster more technical talents knowing both theories and practices. This is a very rare opportunity. He also expects the students of STUST to understand and recognize the corporate culture of ChipMOS under the industrial-academic collaborative programs where the scholarship and internship opportunity are provided by the Company, through not only the improvement of the related professional knowledge and practical experience, but also the practical clerkship of the onsite tasks, to blend into the great family of ChipMOS when they join ChipMOS after their graduation, and become the talents of the Company and the semiconductor packaging industry.

ChipMOS donated three unit of the semiconductor packaging equipment adopted in the key semiconductor packaging processes to the Semiconductor Center of the Engineering School of STUST, for the practical teaching instructed by the senior engineering officers of ChipMOS. Meanwhile, ChipMOS and STUST jointly promote the semiconductor packaging education program to enable students to understand the contents of the onsite tasks before entering the packaging industry, for closing the gap between education and practical work.

In the future, ChipMOS and STUST will have close relationship with the integration of donated machines and curriculums of the school via the long-term partnership established from the industrial-academic collaboration, including the industrial-academic collaborative project of teachers, students’ internship in ChipMOS, and scholarship provided by the Company to the undergraduate and graduate students, which is expected to achieve the employment upon graduation.

▲The conference was conducted jointly (from the left) with Wang, Xin-Ji, Director-General, Labor Affairs Bureau of Tainan City Government; Yang, Yu-Huei, Director-General, Department of Technological and Vocational Education, MOE; Lu, Deng-Mao, President of Southern Taiwan University of Science and Technology;, MOE; Cheng, Shi-Jie, Chairman of ChipMOS; Cheng, Hsiu-Rong, Cheng, Hsiu-Rong, Deputy General-Director of Southern Taiwan Science Park Bureau; and Hsu, Yuan-Feng, the Executive Vice President, Tainan Operation and Manufacturing Center of ChipMOS.

▲Hsu, Yuan-Feng, the Executive Vice President, Tainan Operation and Manufacturing Center of ChipMOS (second to the right) said that the semiconductor packaging equipment donated to the school by ChipMOS is exactly the machine operated for the current production; students will be the immediate force when arriving ChipMOS when they familiarize themselves with the operation in the school.