Copper Pillar Bumping Technology
SnAg Plating Technology
System in Package (SiP) Technology
Flip Chip Technology
Metal Composition Bump (MCB) Technology
Die Stacking Technology
As the memory size increasing, more and more chips are stacked vertically to increase the capacity and keep the same package footprint size. In addition, advanced packaging technology like 2.5D, 3D also need stacking technology.
ChipMOS already be ready for mass production in ODP stacking and is capable to handle HDP die stacking with passive component technology
HDP stacking structure (MCP Package)