Bumping technology is aiming to replace wire bonding as the inter-connection method to accommodate the growing number of components and/or connection requirements. For the considerations of human health and environmental protection, almost all the governments in Europe and Asia have set the deadlines to remove lead (Pb) from consumer electronic devices that use as solder joints in printed circuit boards. The lead-free bumping was then introduced years ago and has the longest production history in flip chip technology, especially.

ChipMOS provides SnAg bumping services, in the form of Cu pillar with a SnAg cap, to customers.