Copper Pillar Bumping Technology SnAg Plating Technology System in Package (SiP) Technology Flip Chip Technology Metal Composition Bump (MCB) Technolo Die Stacking Technology
The gold bump is designed and manufactured to provide a good contact between LCD drive IC and the substrate ( for COF devices) or glass plate (for COG devices). Recent years, gold price fluctuates in a wider range and normally stays at high price level for an extended period of time. Metal composite bump (MCB) technology was then devised to provide a low cost solution for both COF & COG applications of LCD driver ICs aiming to create win-win situation with customer.
MCB technology uses regular bumping processes, such as: sputtering, photo-resist coating, lithography, plating (copper/nickel/gold), to build various metallic bumps on Al pads of LCD driver IC.
Benefits of MCB
- Lower cost compared to Au bump
- Higher bump hardness
- Identical inner-lead bonding or board bonding processes as regular Au bump