The gold bump is designed and manufactured to provide a good contact between LCD drive IC and the substrate ( for COF devices) or glass plate (for COG devices). Recent years, gold price fluctuates in a wider range and normally stays at high price level for an extended period of time. Metal composite bump (MCB) technology was then devised to provide a low cost solution for both COF & COG applications of LCD driver ICs aiming to create win-win situation with customer.

MCB technology uses regular bumping processes, such as: sputtering, photo-resist coating, lithography, plating (copper/nickel/gold), to build various metallic bumps on Al pads of LCD driver IC.

Benefits of MCB
  • Lower cost compared to Au bump
  • Higher bump hardness
  • Identical inner-lead bonding or board bonding processes as regular Au bump