ChipMOS Bumping Overview
Service:
Pillar Bump
Copper Post+ solder Cap Package Type : QFN,FCCSP (pitch < 150um)
Gold Bumping
COF/TCP, COG
Solder Ball Drop
SnAgCu Ball drop .Package Type: FCCSP (pitch >150um), WLCSP
MCB Metal Composited Bump
Cu/Ni/Au bump
RDL
Cu/ Cu-Ni-Au/ Polyimide .Package Type: MCP
ChipMOS Bumping Equipment
| Process Stage | Equipment | Model | Maker |
| Wafer Preparation | Microscope | L200 | Nikon |
| OPTISTATION-3000 | Nikon | ||
| Scrubber | VS-8000 | M. Setek | |
| UFO-300 | GPTC | ||
| SRD | SRD 4300S | AMAT | |
| CT-1206 | CALITECH | ||
| Oven | MOL series | C-SUN | |
| Thin Film Deposition | Sputter | TFE 4451 | TFE |
| Bumper 200 | Tango System | ||
| Robusta series | LPI | ||
| Rs Measurement | ResMap 178 | CDE | |
| ResMap 273 | CDE | ||
| Surface Scan | SP1 | KLA-Tencor | |
| Photo Lithography | PR Coater | VRC-8000 | M. Setek |
| CSX-3262NP | TAZMO | ||
| Stepper | Spectrum 3e | UltraTech | |
| AP200 / AP300 | UltraTech | ||
| Developer | PR developer 200 | ScienTech | |
| CSX3442DP | TAZMO | ||
| PI Coater/Developer | VICD-8000 | M. Setek | |
| CSX-3282NDP | TAZMO | ||
| PI Curing | CLH-35CD | KOYO | |
| Bump/RDL Plating | Plating Bench | Rack plator | ScienTech & Wii-Mong |
| Cup plator | SEC | ||
| DESCUM | System 10 | Matrix | |
| Rydeen-6800 | FOI | ||
| NA-1300 | ULVAC | ||
| Stripper | PR stripper 200 | ScienTech | |
| VAN 200/300 | GPTC | ||
| UBM Etching | UBM Etching Bench | AB-AE-200/300 | GPM |
| AB-TE-200/300 | GPM | ||
| UBM etch 200 | GPM | ||
| UFO-200/300 | GPTC | ||
| Anneal | 320-2 | Centrotherm | |
| CLH-35CD | KOYO | ||
| Measurement & Inspection | Optical Profiler | WYKO NT series | Bruker |
| CyberSurf 3D-WL | Fogale | ||
| Contact Profiler | P10/P15 | KLA-Tencor | |
| P350 | KLA-Tencor | ||
| Shear Tester | Dage-4000 series | Dage | |
| Hardness Tester | OMNIMET MHT | Buehler | |
| HMV-G-FA-S | Shimadzu | ||
| XRF | XDV-u | Fischer | |
| X-ray | Y.Cheetah | Yxlon | |
| AOI | NSX-105 | Rudolph | |
| MV3200-300 | Micron Vision |
ChipMOS Bumping Equipment
ChipMOS Bumping Equipment
Process flow
Gold Bump Process Flow
WLCSP Process Flow
