Mini - BGA (Ball Grid Array): Low-cost and space saving packaging designed for matrix type & fine pitch BGA, which is a cost-effective CSP solution suitable for small form-factor commercial applications.
FBGA (Fine Pitch BGA): FBGA with chip-face-down design is a solution for the high speed memory products.This special structure could provide the shortest signal trace and the excellent electrical performance. Generally, FBGA is designed to have the thickness of 1.2 mm and ball pitch from 0.8 mm to 1.0 mm.
VFBGA (Very Fine Pitch BGA): The VFBGA package has the similar structure of mini-BGA package with the thickness of 1.0 mm and ball pitch less than 0.8 mm. VFBGA package was designed to be used in a wide variety of applications that require small size, high reliability and low unit cost.
Stacked CSP (Chip Scale Packaging): Designed for applications of two or more chips stacked in a single package (ex. SRAM + Flash), allowing for a drastic saving of board space.
MCM (Multi-Chip Module): Using the concept of System-in-Package (SiP), the MCM integrates several chips or passive components into a standard package.
TCP (Tape Carrier Package): TCP is a package with a 3-layer patterned film to provide electrical and mechanical supports to IC chips for LCD panel driver or controller application.
COF (Chip On Film): COF is a package with a 2-layer patterned film with high dimension stability, less stress from lamination, and fine pitch design for LCD driver or controller electronics.
COG (Chip On Glass): A low cost solution for LCD driver or controller IC. The chip is attached onto glass panel directly with conductive adhesive paste.
