量產產品系列

	Product Families

	FBGA (Fine Pitch BGA)

	3D Technology - Stacked CSP

	Chip on Film (COF)

	Chip On Glass (COG)

	Mini-Ball Grid Array (BGA)

	VFBGA (Very Fine Pitch BGA)

	Multi-chip Module - Plastic Ball Grid Array (MCM)

	Land Grid Array (LGA)

	Tape Carrier Package (TCP) / Chip On Film (COF)

	Quad Flat No Lead Package (QFN)

	Quad Flat Package (QFP)

	Low-Profile Quad Flat Pack (LQFP)

	Thin Quad Flat Package (TQFP)

	Multi-Chip & Stacked Leadframe

	Small Outline Package (SOP)

	TSOP-I/TSOP-II/TSOP-II (LOC)

	Plastic Dual-in-Line Package (P-DIP)