The ChipMOS Design Center offers accurate, reliable, fast and cost-effective design to meet manufacturing and customer requirements. The latest commercial and self-developed design software, together with our experienced employees, enables us to serve our customers and meet their various package designs.
The services of the Design Center include: ‧IC package design with metal leadframe and/or laminate interposer ‧TCP/COF package design ‧Package characteristics simulation and measurement, such as: thermal, electrical, thermal-mechanical, … etc.
The ChipMOS Design Center ensures the success of your product development. The available package outlines, leadframe/laminate and trays allow you to shorten the cycle time and minimize the tool review and discussion. Please contact your ChipMOS account manager to get started.
